0
RESEARCH PAPERS

Static and Dynamic Buckling of a Fiber Embedded in a Matrix With Interface Debonding

[+] Author and Article Information
Y. W. Kwon, M. Serttunc

Department of Mechanical Engineering, Naval Postgraduate School, Monterey, CA 93943

J. Pressure Vessel Technol 115(3), 297-301 (Aug 01, 1993) (5 pages) doi:10.1115/1.2929531 History: Received July 06, 1992; Revised May 18, 1993; Online June 17, 2008

Abstract

Analyses were performed for static and dynamic buckling of a continuous fiber embedded in a matrix in order to determine effects of interfacial debonding on the critical buckling load and the domain of instability. A beam on elastic foundation model was used for the study. The study showed that a local interfacial debonding between a fiber and a surrounding matrix resulted in an increase of the wavelength of the buckling mode. An increase of the wavelength yielded a decrease of the static buckling load and lowered the dynamic instability domain. In general, the effect of a partial or complete interfacial debonding on the domain of dynamic instability was more significant than its effect on the static buckling load. For dynamic buckling of a fiber, a local debonding of size 10 to 20 percent of the fiber length had the most important influence on the domains of dynamic instability regardless of the location of debonding and the boundary conditions of the fiber. For static buckling, the location of a local debonding was critical to a free, simply supported fiber, but not to a fiber with both ends simply supported.

Copyright © 1993 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In