An Investigation on Underwater Explosive Bonding Process

[+] Author and Article Information
Hirofumi Iyama

Department of Mechanical and Electrical Engineering, Yatsushiro National College of Technology, Kumamoto 866-8501, Japane-mail: iyama@as.yatsushiro-nct.ac.jp

Akio Kira, Masahiro Fujita

Department of Mechanical Engineering, Sojo University, Kumamoto 860-8691, Japan

Shiro Kubota

Department of Earth Resources, Engineering, Kyushu University, Fukuoka 812-8581, Japan

Kazuyuki Hokamoto

Department of Mechanical Engineering and Materials Science, Kumamoto University, Kumamoto 860-8555, Japan

Shigeru Itoh

Shock Wave and Condensed Matter, Research Center, Kumamoto University, Kumamoto 860-8555, Japan

J. Pressure Vessel Technol 123(4), 486-492 (May 23, 2001) (7 pages) doi:10.1115/1.1388007 History: Received December 17, 2000; Revised May 23, 2001
Copyright © 2001 by ASME
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Setup for the explosive bonding by underwater shock wave method—(a) overall assembly; (b) details of the arrangement of the amorphous film and base plate
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Micrographs of the bonded interface at various conditions
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Models of numerical analysis for the underwater explosive bonding method
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Framing photographs of deformation of flyer plate by underwater shock wave
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The numerically simulated deformation of the flyer plate as shown in Fig. 4
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Displacement histories at x=30 mm from left end of aluminum plate
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Deformation processes of flyer and base plates and pressure distributions for setup no. 3
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Pressure distributions for setup no. 3 at various times from 16 to 26 μs
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Pressure distribution and deformation shape of flyer and base plate at time 20 μs
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A pressure distribution for top surface layer of the base plate at time 20 μs
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The illustration of velocities in the underwater shock wave bonding process
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Changes of velocity Vp versus displacement y for all setup conditions at the position of x=30 mm
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Distributions of collision angle β versus the position of x for all setup conditions
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Moving velocities of collision point and underwater shock wave versus inclined angle
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Weldability window for half-hard copper plates plotted points for all setup conditions




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