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TECHNICAL PAPERS

Time-Accurate, 3-D Computation of Wire Sweep During Plastic Encapsulation of Electronic Components

[+] Author and Article Information
H.-Q. Yang, S. Bayyuk, S. Mazumder, S. Lowry, A. Krishnan, A. Przekwas

CFD Research Corporation, Huntsville, AL 35805

L. Nguyen

National Semiconductor Corporation, Santa Clara, CA 95051e-mail: Luu.Nguyen@nsc.com

J. Pressure Vessel Technol 123(4), 501-509 (Jun 19, 2001) (9 pages) doi:10.1115/1.1401024 History: Received October 31, 2000; Revised June 19, 2001
Copyright © 2001 by ASME
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References

Nguyen,  L. T., 1988, “Wire Bond Behavior During Molding Operations of Electronic Packages,” Polym. Eng. Sci., 28, pp. 926–943.
Nguyen, L. T., Danker, A., Santhiran, N., and Shervin, C. R., 1992, “Flow Modeling of Wire Sweep During Molding of Integrated Circuits,” ASME EEP-Vol. 2, PED-Vol. 60, pp. 27–38.
Tay,  A. O., Yeo,  K. S., Wu,  J. H., and Lin,  T. B., 1995, “Wirebond Deformation During Molding of IC Packages,” ASME J. Electron. Packag., 117, pp. 14–19.
Tay,  A. O., Yeo,  K. S., and Wu,  J. H., 1995b, “The Effect of Wirebond Geometry and Die Setting on Wire Sweep,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 18, No. 1, pp. 201–209.
Wu, J. H., Tay, A. O., Yeo, K. S., and Lin, T. B., 1996, “Three-Dimensional Modeling of Wire Sweep Incorporating Resin Cure,” Electronic Components and Technology Conference, pp. 1047–1055.
Patankar, S., 1980, Numerical Heat Transfer and Fluid Flow, Hemisphere Publishing Corporation, McGraw-Hill, New York, NY.
Hirt,  C., and Nichols,  B., 1981, “Volume of Fluid (VOF) Method for the Dynamics of Free Boundaries,” J. Comput. Phys., 39, pp. 201–225.
Rider, W. J., Kothe, D. B., Mosso, S. J., Cerutti, J. H., and Hochstein, J. I., 1995, “Accurate Solution Algorithms for Incompressible Multiphase Flows,” AIAA Paper 95-0699.
Kamal,  M. R., Sourour,  S., and Ryan,  M. E., 1973, “Integrated Thermo-Rheological Analysis of the Cure of Thermosets,” SPE Tech. Papers, 19, p. 187.
Castro,  J. M., and Macosko,  C. W., 1980, “Kinetics and Rheology of Typical Polyurethane Reaction Injection Molding,” SPE Tech. Papers, 19, p. 434.
Bidstrup-Allen, S.-A., Wang, S.-T., Nguyen, L. T., and Arbalaez, F., 1997, “Rheokinetics Models for Epoxy Molding Compounds Used in IC Encapsulation,” First IEEE International Symposium on Polymeric Electronics Packaging, Norrköping, Sweden, pp. 149–157.
Sherman, F. S., 1990, Viscous Flow, McGraw Hill, New York, NY.
Suhir,  E., and Manzione,  L. T., 1991, “Predicted Stresses in Wire Bonds of Plastic Package During Transfer Molding,” ASME J. Electron. Packag., 113, pp. 16–20.

Figures

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Deformed wire profiles under uniform and parabolic velocity profiles using linear theory with Re=1.5×10−3
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Deformed wire profiles under a parabolic velocity profile using linear and nonlinear theory with Re=1.5×10−3
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Maximum deflection of wire predicted by linear elastic and large-deformation theories
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Predicted deflections of wirebond under a lateral flow load using nonlinear theory
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Comparison of the predictions of linear and nonlinear theory for the deformed geometry
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Maximum deflections of curved wirebond under lateral flow loads
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Deflection of curved wirebonds under in-plane flow force with Re=2.4×10−3
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Maximum deflection of curved wirebonds under in-plane loads
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Mold and die geometries, and locations and shapes of wires 1 to 12
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(a) The melt-front position after 1.25 s; (b) the melt-front position after 3.75 s; (c) the melt-front position after 6.25 s; (d) the melt-front position after 8.75 s
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Wire deformation patterns (scaled by a factor of 5) throughout the package as a function of time—(a) wire distortions after 3.0 s; (b) wire distortions after 4.5 s; (c) wire distortions after 7.0 s
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The maximum displacement as a function of time during the filling cycle for wires 1, 3, and 5
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The maximum von mises stress as a function of time during the filling cycle for wires 1, 3, and 5

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