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TECHNICAL PAPERS

Time-Accurate, 3-D Computation of Wire Sweep During Plastic Encapsulation of Electronic Components

[+] Author and Article Information
H.-Q. Yang, S. Bayyuk, S. Mazumder, S. Lowry, A. Krishnan, A. Przekwas

CFD Research Corporation, Huntsville, AL 35805

L. Nguyen

National Semiconductor Corporation, Santa Clara, CA 95051e-mail: Luu.Nguyen@nsc.com

J. Pressure Vessel Technol 123(4), 501-509 (Jun 19, 2001) (9 pages) doi:10.1115/1.1401024 History: Received October 31, 2000; Revised June 19, 2001
Copyright © 2001 by ASME
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References

Figures

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Deformed wire profiles under uniform and parabolic velocity profiles using linear theory with Re=1.5×10−3
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Deformed wire profiles under a parabolic velocity profile using linear and nonlinear theory with Re=1.5×10−3
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Maximum deflection of wire predicted by linear elastic and large-deformation theories
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Predicted deflections of wirebond under a lateral flow load using nonlinear theory
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Comparison of the predictions of linear and nonlinear theory for the deformed geometry
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Maximum deflections of curved wirebond under lateral flow loads
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Deflection of curved wirebonds under in-plane flow force with Re=2.4×10−3
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Maximum deflection of curved wirebonds under in-plane loads
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Mold and die geometries, and locations and shapes of wires 1 to 12
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(a) The melt-front position after 1.25 s; (b) the melt-front position after 3.75 s; (c) the melt-front position after 6.25 s; (d) the melt-front position after 8.75 s
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Wire deformation patterns (scaled by a factor of 5) throughout the package as a function of time—(a) wire distortions after 3.0 s; (b) wire distortions after 4.5 s; (c) wire distortions after 7.0 s
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The maximum displacement as a function of time during the filling cycle for wires 1, 3, and 5
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The maximum von mises stress as a function of time during the filling cycle for wires 1, 3, and 5

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