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TECHNICAL PAPERS

Enhanced Measurement of Residual Stress by Speckle Correlation Interferometry and Local Heat Treating for Low Stress Levels

[+] Author and Article Information
Martin J. Pechersky

Westinghouse Savannah River Company, Aiken, SC 29808 e-mail: martin.pechersky@srs.gov

Chandra S. Vikram

The University of Alabama, Huntsville, AL 35899

J. Pressure Vessel Technol 124(3), 371-374 (Jul 26, 2002) (4 pages) doi:10.1115/1.1482086 History: Received December 07, 2000; Revised March 29, 2001; Online July 26, 2002
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References

Pechersky,  M. J., Miller,  R. F., and Vikram,  C. S., 1995, “Residual Stress Measurements with Laser Speckle Correlation Interferometry and Local Heat Treating,” Opt. Eng. (Bellingham), 34, No. 10, Oct., pp. 2964–2971.
Vikram,  C. S., Pechersky,  M. J., Feng,  C., and Engelhaupt,  D., 1996, “Residual Stress Analysis by Local Laser Heating and Speckle Correlation Interferometry,” Exp. Tech., 20, No. 6, Nov./Dec., pp. 27–30.
Pechersky, M., and Vikram, C. S., 1997, “Determination of Residual Stresses by Local Annealing and Laser Speckle Pattern Interferometry,” Post Conference Proc. 1997 SEM Spring Conference on Experimental Mechanics, Bellevue, WA, June 2–4, pp. 116–120.
Pechersky, M. J., Lam, P. S., and Vikram, C. S., 1998, “Bi-directional Residual Stress Measurements with Laser Annealing and Speckle Interferometry,” Proc. SEM Spring Conference on Experimental and Applied Mechanics and Experimental/Numerical Mechanics in Electronic Packaging III, Houston, TX, June 1–3, pp. 184–186.
Vikram,  C. S., and Pechersky,  M. J., 1999, “Wedge Prism for Direction Resolved Speckle Correlation Interferometry,” Opt. Eng. (Bellingham), 38, No. 10, Oct., pp. 1743–1747.
Pechersky, M. J., Estochen, E., and Vikram, C. S., 1999, “Measurement of Residual Stresses with Through Thickness Gradients Using Laser Heating and Speckle Interferometry,” Proc. SEM Annual Conference on Theoretical, Experimental and Computational Mechanics, Cincinnati, OH, June 7–9, pp. 746–749.

Figures

Grahic Jump Location
Fringe pattern after 5 s, tensile load equals 50% of yield
Grahic Jump Location
90% pretension, room temperature 19.9°C; minimum temperature −53.8°C, tension reading crossed 115% of yield
Grahic Jump Location
70% pretension, room temperature 19.9°C; minimum temperature −45°C; tension reading crossed 90% of yield
Grahic Jump Location
50% pretension, room temperature 20.1°C; minimum temperature −54°C; tension reading crossed 65% of yield
Grahic Jump Location
Schematic diagram showing copper block cooling contact (gray) areas of the tensile specimen (ASTM standard E8; 0.100 in. thick×8 in. long×34 in. wide grips with reduced 1/2 in. gage area)
Grahic Jump Location
Fringe pattern after 15 s, tensile load equals 90% of yield
Grahic Jump Location
Fringe pattern after 5 s, tensile load equals 90% of yield
Grahic Jump Location
Fringe pattern after 15 s, tensile load equals 70% of yield
Grahic Jump Location
Fringe pattern after 5 s, tensile load equals 70% of yield
Grahic Jump Location
Fringe pattern after 15 s, tensile load equals 50% of yield

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