On the Use of the Hole-Drilling Technique for Residual Stress Measurements in Thin Plates

[+] Author and Article Information
R. W. Hampton

Test Engineering and Analysis Branch, NASA Ames Research Center, Moffett Field, CA 94035

D. V. Nelson

Mechanical Engineering Department, Stanford University, Stanford, CA 94305-4021

J. Pressure Vessel Technol 114(3), 292-299 (Aug 01, 1992) (8 pages) doi:10.1115/1.2929043 History: Received June 11, 1990; Revised March 31, 1992; Online June 17, 2008


The strain gage blind hole-drilling technique may be used to determine residual stresses at and below the surface of components. In this paper, the hole-drilling analysis methodology for thick plates is reviewed, and experimental data are used to evaluate the methodology and to assess its applicability to thin plates. Data on the effects of gage pattern, surface preparation, hole spacing, hole eccentricity, and stress level are also presented.

Copyright © 1992 by The American Society of Mechanical Engineers
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